更详细些的资料:
http://www.gigawavetech.com/data//f-ProductSegment/PSECDGWTRD0_Bluetooth_Fr
eedom_Flyer_V1_1_Aug01.PDF
Website: www.gigawavetech.com
The Bluetooth� MODULE FREEDOM is a design for
manufacture, a "ready for production" board. Used in
Dongles, Cradles or intergrated into existing boards it
enables Motherboards, Notebooks, PDAs, MP3-Players
or Printers with the Bluetooth� functionality.
Features
� � Single side mounted PCB
� � Ready for production design
� � Class 1 (+20 dBm) output power
� � Typical sensitivity of -85dBm
� � Typical operating voltage 3.3Vdc
� � 1.2dBi LTCC antenna built-in
� � UART interface (920 kbps) full
duplex mode
� � Dimension 48 x 28 mm
2
� � No physical tuning required
� � Upgradeable Firmware
(LMP/LC/HCI) implemented
� � Bluetooth V1.1 compliant
� � Using BQB approved chipset
� � Very competitive BOM
� � Low power consumption
� � BQB approved Dec. '01
Product
� � 2 Prototype modules
� � Gerber file
� � Documentation
� � BOM
� � Test plan
� � Available Sept. '01
Customisations
� � Change PCB material
� � Direct on board design
� � Different form factor
� � Class 2/3 (+4/0 dBm)
� � Lowest voltage 2.7Vdc
� � USB interface added
� � Dimension 25 x 25 mm
class 2/3 without antenna
� � Dimension 25 x 25 mm
class 1 with double-sided PCB
� � FLASH removed by ROM-based
baseband IC
� � Very low power consumption
design
� � Production test setup
The fully integrated Bluetooth� module is
built with a highly homogenous & tightly
controlled printed circuit board material similar
to the Getek material for consistent & low
variation RF performance. The module with
fully built-in class 1 (+20dBm) operation power
amplifier, antenna, bandpass filter, RFIC, BB
IC, FLASH memory, EEPROM and 13MHz
crystal is 48 x 28 mm 2 in dimension. With our
in-house design capability and knowledge, the
module can be further customized for smaller
size, custom shapes, customized partitioning,
and direct built-in on the same target board.
For class 2 (+4dBm) operation, the module
can be 25 x 25 mm 2 on a single-sided board
for a design without the antenna and the
external power amplifier.
A class 1 module with double-sided board can
be also as small as 25 x 25 mm 2 .
The design allows upgrade to the firmware
easily in the future. For a low cost design, the
FLASH memory may be removed and a
ROM-based baseband IC can be used,
achieving significant bill-of-material (BOM)
saving.
For most cost effective implementation, a
direct built-in on board design is
recommended. This customisation will be fully
supported by GigaWaveTech's in-house RF,
hardware and layout designers. Additional
services for production test and qualification
can be supported as well.
Target Applications
� � PC motherboard
� � Notebook motherboard
� � PDA with high speed UART I/O
� � Add-on cards such as PCI
Bluetooth Card
� � Embedded applications
� � GSM/GPRS-Bluetooth� module
� � Digital Entertainment systems
� � Printers
� � Digital Camera
� � Bluetooth� Access point
� � V.90/ADSL modem
2001-12-06